My expertise: My primary research interests are in modelling for additive manufacturing, multiscale methods, computational materials science, and computational mechanics. My current research focuses on processing-microstructure-property relationships in metal additive manufacturing. My research philosophy is to transfer knowledge to practice. I am always keen to collaborate with academics and industry professionals interested in additive manufacturing.
My bio: Since 2022 I am a Lecturer (equivalent to the rank of assistant professor in North America) in Mechanical Engineering in the School of Engineering and Information Technology (SEIT) at UNSW Canberra. Before coming to UNSW, I conducted postdoctoral research a the University of Bremen (DE) being a part of the Airbus Endowed Chair for Integrative Simulation and Engineering of Materials and Processes. My previous experience also includes work at the Russian Academy of Sciences, Tomsk Polytechnic University, and Tomsk State University (RU), and being a visiting researcher at UNSW Canberra, University of Bremen, Sao Paulo State University (BR), and Centre of Materials Mines ParisTech (FR).
*** UNSW Canberra offers faculty scholarships of up to $35,000 per annum for PhD students who hold or are close to completion of a First-Class Honours or equivalent undergraduate degree and/or have completed a Masters by Research. In addition, you must meet the UNSW English language requirements.
I am keen to consider applications for projects on modelling for metal additive manufacturing, in particular on
- processing-microstructure-property relationships
- different types of mechanical loading of additively manufactured materials
- model development and optimisation for the topics mentioned above
If you are eligible and interested, please send me an email with
(1) a short motivation statement
(2) your academic CV
(3) your academic transcripts
(4) your main research interest and your research proposal (<150 words)
(5) links to your Google Scholar page, ResearchGate page, Scopus ID, etc.